90% NEW YAMAHA YV100XG SMT Machine
90% NEW YAMAHA YV100XG SMT Machine
Condition:Used
Marketing Type:Ordinary Product
Core Components: PLC
Brand Name:YAMAHA
1) High-speed and high-precision multi-functional modular placement machine
2) 0.18 seconds/CHIP ultra high speed placement (best condition) 16200CPH (grain/hour)
3) In the IPC9850 state, the patch speed is up to 16200CPH (corresponding to 0.22 seconds/CHIP)
4) Mount 0603 components, the whole precision up to ± 50 microns, full repeat accuracy up to ± 30 microns
5) Wide range of applications, from 0201 (inch) microcomponents to 31mm QFP large components
6) Using 2 high resolution multi-vision digital cameras
7) Continuous solder ball recognition for CSP/BGA components, including the determination of the defect of solder balls
8) The YAMAHA patented flight change nozzle can be selected, which can effectively reduce the machine idle loss
9) The best choice for universal type
10) The Y-axis is driven by high-power servo amplifiers and high-rigidity screw rods at the left and right ends.
This newly developed fully-fixed dual-driver technology accelerates acceleration and co-ordination
through both ends to drive and completes the acceleration function. Reduced positioning time.
90% NEW YAMAHA YV100XG SMT Machine
YV100XG
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Condition:Used.
Marketing Type:Ordinary Product.
Core Components: PLC.
Brand Name:YAMAHA.
1) High-speed and high-precision multi-functional modular placement machine.
2) 0.18 seconds/CHIP ultra high speed placement (best condition) 16200CPH (grain/hour).
3) In the IPC9850 state, the patch speed is up to 16200CPH (corresponding to 0.22 seconds/CHIP).
4) Mount 0603 components, the whole precision up to ± 50 microns, full repeat accuracy up to ± 30 microns.
5) Wide range of applications, from 0201 (inch) microcomponents to 31mm QFP large components.
6) Using 2 high resolution multi-vision digital cameras.
7) Continuous solder ball recognition for CSP/BGA components, including the determination of the defect of solder balls.
8) The YAMAHA patented flight change nozzle can be selected, which can effectively reduce the machine idle loss.
9) The best choice for universal type.
10) The Y-axis is driven by high-power servo amplifiers and high-rigidity screw rods at the left and right ends.
This newly developed fully-fixed dual-driver technology accelerates acceleration and co-ordination.
through both ends to drive and completes the acceleration function. Reduced positioning time.
The specifications of the YAMAHA YV100XG placement machine include: |
| Placement Speed: 0.18 seconds/CHIP, meaning that under optimal conditions, the YV100XG can place a single chip at a speed of 0.18 seconds. Additionally, under IPC9850 standards, the placement speed reaches up to 16,200 CPH (components per hour), equivalent to 0.22 seconds per chip. |
| Placement Accuracy: For CHIP components, the placement accuracy is ±0.1mm; for QFP components, it is ±0.04mm. This ensures high precision in component placement, meeting the quality requirements of various electronic products. |
| Range of Placeable Components: Suitable for components ranging from 0201 (imperial) miniature to 31mm QFP large-sized components, covering a wide range of component sizes. |
| Recognition Method: Utilizes high-resolution multi-vision precision digital cameras capable of continuous recognition of all solder balls, including CSP/BGA components, with a function to judge the quality of solder balls. |
| Substrate Size: The M type substrate size ranges from L460W335(MAX) to L50W50(MIN), and the L type substrate size ranges from L460W440(MAX) to L50W50(MIN), meeting the needs for different substrate sizes. |
| Power and Air Supply Requirements: Requires a power supply of 200V, 3KVA and an air supply of 150L/min, 0.5MPa. |
| These specifications indicate that the YAMAHA YV100XG placement machine is a high-speed, high-precision, multifunctional medium-speed placement machine suitable for the production of various electronic products, especially in fields requiring high-precision placement. |
